march 2010 doc id 16953 rev 1 1/10 10 STPS20100HR aerospace 1 x 20 and 2 x 20 a - 100 v schottky rectifier features forward current: 1 x 20 and 2 x 20 a repetitive peak voltage: 100 v low forward voltage drop: 0.8 v maximum junction temperature: 175 c negligible switching losses low capacitance high reverse avalanche surge capability hermetic packages target radiation qualification: ? 150 krad (si) low dose rate ? 1 mrad high dose rate escc qualified description this power schottky rectifier is designed and packaged to comply with the escc5000 specification for aerospace products. housed in hermetically sealed packages both surface mount and through hole, it is ideal for use in applications for aerospace and other harsh environments. the STPS20100HR is intended for use in medium voltage application and particularly, in high frequency circuits where low switching losses and low noise are required. to-254 smd.5 table 1. device summary order code escc detailed specification quality level configuration package mass eppl stps20100s1 - engineering model single die smd.5 2.0 g - stps20100shrb 5106/016/05 escc flight - stps20100fsyhrb 5106/016/01 escc flight single die to-254 10.0 g - stps20100afsy1 - engineering model double die, common anode - stps20100afsyhrb 5106/016/02 escc flight y stps20100cfsy1 - engineering model double die, common cathode - stps20100cfsyhrb 5106/016/03 escc flight y stps20100sfsyhrb 5106/016/04 escc flight double die, serial y www.st.com
characteristics STPS20100HR 2/10 doc id 16953 rev 1 1 characteristics table 2. absolute maximum ratings symbol characteristic value unit i fsm forward surge current (per diode) (1) 1. sinusoidal pulse of 10 ms duration 250 a v rrm repetitive peak reverse voltage (2) 2. pulsed, duration 5 ms, f = 50 hz 100 v i rrm repetitive peak reverse current (3) 3. pulsed, duration 2 s, f = 1 khz 1a i o average output rect ified current (50% duty cycle): (4) , (5) all variants (per diode) variants 02, and 03 (per device) 4. for t case > +140 c, derate linearly to 0 a at +175 c. 5. the ?per device? ratings apply only as follows: variant 02: when both cathode terminals are tied together variant 03: when both anode terminals are tied together. 20 40 a i f(rms) forward rms current (per diode) 30 a t op operating temperature range (6) (case temperature) 6. for variants with hot solder dip l ead finish all testing performed at t amb > +125 c are carried out in a 100% inert atmosphere. -65 to +175 c t j junction temperature +175 c t stg storage temperature range (6) -65 to +175 c t sol soldering temperature: for to-254 (7) for smd.5 (8) 7. duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. 8. duration 5 seconds maximum and the same package shall not be resoldered until 3 minutes have elapsed. +260 +245 o c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol characteristic value unit r th(j-c) (1) 1. package mounted on infinite heatsink thermal resistance, junction to case variants 01, and 05 variants 02, 03 and 04 (per diode) variants 02, and 03 (per device) (2) 2. the per device ratings apply for variant 02 when both ca thode terminals are tied together and for variant 03 when when both anode terminals are tied togther. 1.65 1.65 0.85 c/w
STPS20100HR characteristics doc id 16953 rev 1 3/10 s table 4. electrical measurements at ambiant temperature (per diode), t amb = 22 3 c symbol characteristic mil-std-750 test method test conditions values units min. max. i r reverse current 4016 dc method, v r = 100 v - 30 a v f1 (1) forward voltage 4011 pulse method, i f = 10 a - 780 mv v f2 (1) pulse method, i f = 20 a - 1 v c capacitance 4001 v r = 10 v, f = 1 mhz - 700 pf z th(j-c) relative thermal impedance, junction to case 3101 i h = 15 to 40 a, t h = 50 ms i m = 50 ma, t md = 100 s calculate v f c/w 1. pulse width 680s, duty cycle 2% table 5. electrical measurements at high and low temperatures (per diode) symbol characteristic mil-std-750 test method test conditions values units min. max. i r reverse current 4016 t case = +125 (+0, -5) c dc method, v r = 100 v -20ma v f2 (1) forward voltage 4011 t case = +125 (+0, -5) c pulse method, i f = 20 a -900mv t case = -55 (+5, -0) c pulse method, i f = 20 a -1.1v 1. pulse width 680s, duty cycle 2%
configurations STPS20100HR 4/10 doc id 16953 rev 1 2 configurations figure 1. available device configurations 1 2 3 1 2 3 2 1 3 2 1 3 1 3 variant 01 stps20100fsyhrb variant 02 stps20100afsy1 stps20100afsyhrb variant 03 stps20100cfsy1 stps20100cfsyhrb variant 04 stps20100sfsyhrb variant 05 stps20100s1 stps20100shrb terminal 1: terminal 2: terminal 3: cathode no connection anode terminal 1: terminal 2: terminal 3: terminal 1: terminal 2: terminal 3: terminal 1: terminal 2: terminal 3: terminal 1: terminal 2: terminal 3: for to-254 the case is not connected to any lead for smd.5 the lid is not connected to any terminal cathode a common anode cathode b anode a common cathode anode b anode a center tap cathode b anode anode cathode
STPS20100HR package information doc id 16953 rev 1 5/10 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 2. metal flange mount package (to-254 (a) ), 3 lead dimension definitions a. the terminal identification is specif ied by the device configuration. see figure 1 for terminal connections b a c d e ?f g h ?i j k k l ?m n r1 r2 1 2 3
package information STPS20100HR 6/10 doc id 16953 rev 1 table 6. metal flange mount package (to-254), 3-lead dimension values reference dimension in millimetres dimlension in inches min. max. min. max. a 13.59 13.84 0.535 0.545 b 13.59 13.84 0.535 0.545 c 20.07 20.32 0.790 0.800 d 6.3 6.7 0.248 0.264 e 1 3.9 0.039 0.154 ?f 3.5 3.9 0.138 0.154 g 16.89 17.4 0.665 0.685 h 6.86 bsc 0.270 bsc ?i (1) 1. 3 locations 0.89 1.14 0.035 0.045 j 3.81 bsc 0.150 bsc k 3.81 bsc 0.150 bsc l 12.95 14.5 0.510 0.571 ?m 3.05 typ. 0.120 typ. n - 0.71 - 0.028 r1 (2) 2. radius of heatsink flange corner - 4 locations - 1 - 0.039 r2 (3) 3. radius of body corner - 4 locations 1.65 typ. 0.065
STPS20100HR package information doc id 16953 rev 1 7/10 figure 3. surface mount package (smd.5), 3-terminal dimension definitions table 7. surface mount package (smd.5), 3-terminal dimension values reference dimension in millimetres dimlension in inches min. max. min. max. a 2.84 3.15 0.112 0.124 a1 0.25 0.51 0.010 0.20 b 7.13 7.39 0.281 0.291 b1 5.58 5.84 0.220 0.230 b2 (1) 1. 2 locations 2.28 2.54 0.090 0.100 b3 (1) 2.92 3.18 0.115 0.125 d 10.03 10.28 0.395 0.405 d1 (1) 0.76 - 0.030 - e 7.39 7.64 0.291 0.301 e (1) 1.91 bsc 0.075 1 2 3 a a1 b b1 b2 b3 d1 e e d
ordering information STPS20100HR 8/10 doc id 16953 rev 1 4 ordering information table 8. ordering information order code escc detailed specification package lead finish marking eppl mass (g) packing stps20100s1 - smd.5 gold stps20100s1 - 2.0 waffle pack stps20100shrb 5106/016/05 gold 510601605 - stps20100fsyhrb 5106/016/01 to-254 solder dip 510601601 + beo - 10.0 stps20100afsy1 - gold stps20100afsy1 + beo - stps20100afsyhrb 5106/016/02 solder dip 510601602 + beo y stps20100cfsy1 - gold stps20100cfsy1 + beo - stps20100cfsyhrb 5106/016/03 solder dip 510601603 + beo y stps20100sfsyhrb 5106/016/04 solder dip 510601604 + beo y
STPS20100HR revision history doc id 16953 rev 1 9/10 5 revision history table 9. document revision history date revision changes 25-mar-2010 1 initial release.
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